Our Services
We offer the following services:
- Through Hole Assembly
- Surface Mount Assembly
- Prototype Assembly
- Board Rework
- Lead Free Assemblies
MANUFACTURING CAPABILITIES
Our Capabilities Include
- Conventional through hole component technology
- Surface mount technology bullet BGA (Ball Grid Array)
- Flex Circuits
- X-ray and Microscope Inspection
- Consignment or turnkey
- 24 hour, quick turn about assemblies
- Prototype to medium volume production
- Conformal coating
- Printed Circuit Board (PCB) Services
- Chassis & Product Assembly
- Cable & Harness Assembly
- Final Packaging .
REWORK SERVICES
- Component Replacement
- Custom Modifications
- Dense Connector Replacement
- Over night services by request
